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"A reliable solderless connection technique for high I/O counts ceramic ..."
Jean-Baptiste Sauveplane et al. (2015)
- Jean-Baptiste Sauveplane, Patrice Retho, Norbert Venet, David Buso, Guy Perez, Jean-Sébastien Lefrileux:
A reliable solderless connection technique for high I/O counts ceramic land grid array package for space applications. Microelectron. Reliab. 55(9-10): 1815-1820 (2015)
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