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"High temperature ageing of microelectronics assemblies with SAC solder joints."

Wissam Sabbah et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.06.065

access: closed

type: Journal Article

metadata version: 2021-10-14

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  dblp key:
  - journals/mr/SabbahBABFGM17
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  - https://dblp.org/rec/journals/mr/SabbahBABFGM17
Wissam Sabbah, Pierre Bondue, Oriol Avino-Salvado, Cyril Buttay, Hélène Frémont, Alexandrine Guédon-Gracia, Hervé Morel:
High temperature ageing of microelectronics assemblies with SAC solder joints. Microelectron. Reliab. 76-77: 362-367 (2017)

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