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"Effect of gas type and flow rate on Cu free air ball formation in ..."

A. Pequegnat et al. (2011)

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DOI: 10.1016/J.MICROREL.2010.02.023

access: closed

type: Journal Article

metadata version: 2023-11-13

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A. Pequegnat, H. J. Kim, M. Mayer, Norman Y. Zhou, John Persic, J. T. Moon:
Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding. Microelectron. Reliab. 51(1): 43-52 (2011)

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