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"Development of bulk nanostructured copper with superior hardness for use ..."

M. Y. Pan et al. (2006)

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DOI: 10.1016/J.MICROREL.2005.06.009

access: closed

type: Journal Article

metadata version: 2023-08-15

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M. Y. Pan, Manoj Gupta, Andrew A. O. Tay, Kripesh Vaidyanathan:
Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging. Microelectron. Reliab. 46(5-6): 763-767 (2006)

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