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"Growth of tin whiskers for lead-free plated leadframe packages in high ..."

Yoshikuni Nakadaira et al. (2008)

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DOI: 10.1016/J.MICROREL.2007.01.091

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/NakadairaJSSMCKO08
Yoshikuni Nakadaira, Seyoung Jeong, Jongbo Shim, Jaiseok Seo, Sunhee Min, Taeje Cho, Sayoon Kang, Seyong Oh:
Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling. Microelectron. Reliab. 48(1): 83-104 (2008)

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