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"Electro- and thermomigration induced Cu3Sn and ..."
Lutz Meinshausen et al. (2015)
- Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage, Bernard Plano:
Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps. Microelectron. Reliab. 55(1): 192-200 (2015)
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