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"Wafer-level packaging of silicon to glass with a BCB intermediate layer ..."

Norbert Lorenz, Martin D. Smith, Duncan P. Hand (2011)

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DOI: 10.1016/J.MICROREL.2011.04.010

access: closed

type: Journal Article

metadata version: 2023-05-01

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Norbert Lorenz, Martin D. Smith, Duncan P. Hand:
Wafer-level packaging of silicon to glass with a BCB intermediate layer using localised laser heating. Microelectron. Reliab. 51(12): 2257-2262 (2011)

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