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"Study of Al-Cu compounds as soldering bond pad for high-power device ..."
Wei Chih Liu et al. (2015)
- Wei Chih Liu, Yan Hao Chen, Te-yuan Chung, Cheng Yi Liu:
Study of Al-Cu compounds as soldering bond pad for high-power device packaging. Microelectron. Reliab. 55(12): 2549-2553 (2015)
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