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"Fabrication and thermal analysis of flip-chip light-emitting diodes with ..."

Cheng-Chen Lin et al. (2010)

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DOI: 10.1016/J.MICROREL.2010.01.036

access: closed

type: Journal Article

metadata version: 2020-02-22

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Cheng-Chen Lin, Liann-Be Chang, Ming-Jer Jeng, Chia-Yi Yen, Atanu Das, Chung-Yi Tang, Ming-Yi Tsai, Mu-Jen Lai:
Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps. Microelectron. Reliab. 50(5): 683-687 (2010)

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