"Induced thermo-mechanical reliability of copper-filled TSV interposer by ..."

Chang-Chun Lee, Chien-Chao Huang (2015)

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DOI: 10.1016/J.MICROREL.2015.05.002

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type: Journal Article

metadata version: 2024-10-06

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Chang-Chun Lee, Chien-Chao Huang:
Induced thermo-mechanical reliability of copper-filled TSV interposer by transient selective annealing technology. Microelectron. Reliab. 55(11): 2213-2219 (2015)

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