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"Residual compression in area array packages induced by underfill shrinkage."

Michael C. Larson, Melody A. Verges, Xia Liu (2006)

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DOI: 10.1016/J.MICROREL.2005.04.001

access: closed

type: Journal Article

metadata version: 2020-02-22

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Michael C. Larson, Melody A. Verges, Xia Liu:
Residual compression in area array packages induced by underfill shrinkage. Microelectron. Reliab. 46(2-4): 496-502 (2006)

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