"Numerical analysis of thermo-mechanical characteristics of solder joint ..."

YongHyuk Kwon et al. (2015)

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DOI: 10.1016/J.MICROREL.2014.11.005

access: closed

type: Journal Article

metadata version: 2020-02-22

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YongHyuk Kwon, HeeSeon Bang, Sungmin Joo, HanSur Bang:
Numerical analysis of thermo-mechanical characteristics of solder joint depending on change in solder junction structure of MCP. Microelectron. Reliab. 55(2): 442-447 (2015)

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