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"Warpage mechanism analyses of strip panel type PBGA chip packaging."
Yeong K. Kim, In Soo Park, Jooho Choi (2010)
- Yeong K. Kim, In Soo Park, Jooho Choi:
Warpage mechanism analyses of strip panel type PBGA chip packaging. Microelectron. Reliab. 50(3): 398-406 (2010)
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