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"Warpage mechanism analyses of strip panel type PBGA chip packaging."

Yeong K. Kim, In Soo Park, Jooho Choi (2010)

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DOI: 10.1016/J.MICROREL.2009.12.010

access: closed

type: Journal Article

metadata version: 2020-02-22

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Yeong K. Kim, In Soo Park, Jooho Choi:
Warpage mechanism analyses of strip panel type PBGA chip packaging. Microelectron. Reliab. 50(3): 398-406 (2010)

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