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"Vibration fatigue reliability of BGA-IC package with Pb-free solder and ..."

YoungBae Kim, Hiroshi Noguchi, Masazumi Amagai (2006)

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DOI: 10.1016/J.MICROREL.2005.02.003

access: closed

type: Journal Article

metadata version: 2020-02-22

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YoungBae Kim, Hiroshi Noguchi, Masazumi Amagai:
Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb-Sn solder. Microelectron. Reliab. 46(2-4): 459-466 (2006)

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