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"PBGA packaging reliability assessments under random vibrations for space ..."

Yeong K. Kim, Do Soon Hwang (2015)

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DOI: 10.1016/J.MICROREL.2014.09.022

access: closed

type: Journal Article

metadata version: 2020-02-22

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Yeong K. Kim, Do Soon Hwang:
PBGA packaging reliability assessments under random vibrations for space applications. Microelectron. Reliab. 55(1): 172-179 (2015)

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