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"Thermal analysis of a flip chip ceramic ball grid array (CBGA) package."

Ravi Kandasamy, A. S. Mujumdar (2008)

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DOI: 10.1016/J.MICROREL.2007.05.005

access: closed

type: Journal Article

metadata version: 2020-02-22

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Ravi Kandasamy, A. S. Mujumdar:
Thermal analysis of a flip chip ceramic ball grid array (CBGA) package. Microelectron. Reliab. 48(2): 261-273 (2008)

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