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"Effect of wafer thinning methods towards fracture strength and topography ..."
Hoh Huey Jiun et al. (2006)
- Hoh Huey Jiun, Ibrahim Ahmad, Azman Jalar, Ghazali Omar:
Effect of wafer thinning methods towards fracture strength and topography of silicon die. Microelectron. Reliab. 46(5-6): 836-845 (2006)
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