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"Electromigration of Cu/low dielectric constant interconnects."

Chao-Kun Hu, Lynne M. Gignac, R. Rosenberg (2006)

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DOI: 10.1016/J.MICROREL.2005.05.015

access: closed

type: Journal Article

metadata version: 2023-09-11

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Chao-Kun Hu, Lynne M. Gignac, R. Rosenberg:
Electromigration of Cu/low dielectric constant interconnects. Microelectron. Reliab. 46(2-4): 213-231 (2006)

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