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"Copper Through Silicon Vias Studied by Photo-elastic Scanning Infrared ..."

Martin Herms, Matthias Wagner, Ingrid De Wolf (2016)

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DOI: 10.1016/J.MICROREL.2016.07.035

access: closed

type: Journal Article

metadata version: 2022-03-28

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Martin Herms, Matthias Wagner, Ingrid De Wolf:
Copper Through Silicon Vias Studied by Photo-elastic Scanning Infrared Microscopy. Microelectron. Reliab. 64: 330-335 (2016)

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