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"Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball ..."
Chunjing Hang et al. (2008)
- Chunjing Hang, Chunqing Wang, M. Mayer, Yanhong Tian, Norman Y. Zhou
, Honghui Wang:
Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging. Microelectron. Reliab. 48(3): 416-424 (2008)
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