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"Wafer-Level Chip-Scale Packaging (Analog and Power Electronics Packaging), ..."

Chong Leong Gan, Uda Hashim (2015)

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DOI: 10.1016/J.MICROREL.2015.08.007

access: closed

type: Journal Article

metadata version: 2020-02-22

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Chong Leong Gan, Uda Hashim:
Wafer-Level Chip-Scale Packaging (Analog and Power Electronics Packaging), XVII. Springer (2015), 322, ISBN: 978-1-4939-1555-2. Microelectron. Reliab. 55(11): 2481 (2015)

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