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"Lifetime analysis of solder joints in high power IGBT modules for ..."

Lydia Feller, Samuel Hartmann, Daniel Schneider (2008)

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DOI: 10.1016/J.MICROREL.2008.07.019

access: closed

type: Journal Article

metadata version: 2022-02-03

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Lydia Feller, Samuel Hartmann, Daniel Schneider:
Lifetime analysis of solder joints in high power IGBT modules for increasing the reliability for operation at 150 degreeC. Microelectron. Reliab. 48(8-9): 1161-1166 (2008)

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