"On chip-package stress interaction."

W. D. van Driel, Dao-Guo Yang, G. Q. Zhang (2008)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2008.06.039

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/DrielYZ08
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/DrielYZ08
W. D. van Driel, Dao-Guo Yang, G. Q. Zhang:
On chip-package stress interaction. Microelectron. Reliab. 48(8-9): 1268-1272 (2008)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.