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"Nickel-palladium bond pads for copper wire bonding."

Horst Clauberg, Petra Backus, Bob Chylak (2011)

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DOI: 10.1016/J.MICROREL.2010.05.001

access: closed

type: Journal Article

metadata version: 2020-02-22

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Horst Clauberg, Petra Backus, Bob Chylak:
Nickel-palladium bond pads for copper wire bonding. Microelectron. Reliab. 51(1): 75-80 (2011)

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