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"Investigation of mechanical shock testing of lead-free SAC solder joints ..."

Y. T. Chin et al. (2008)

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DOI: 10.1016/J.MICROREL.2008.04.003

access: closed

type: Journal Article

metadata version: 2022-01-05

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Y. T. Chin, P. K. Lam, H. K. Yow, Teck Yong Tou:
Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package. Microelectron. Reliab. 48(7): 1079-1086 (2008)

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