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"Stability of the warpage in a PBGA package subjected to hygro-thermal loading."

Chi-Hui Chien et al. (2006)

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DOI: 10.1016/J.MICROREL.2005.03.012

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/ChienCCCHW06
Chi-Hui Chien, Thaiping Chen, Yung-Chang Chen, Yii-Tay Chiou, Chi-Chang Hsieh, Yii-Der Wu:
Stability of the warpage in a PBGA package subjected to hygro-thermal loading. Microelectron. Reliab. 46(7): 1139-1147 (2006)

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