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"Numerical and experimental analysis of the Sn3.5Ag0.75Cu solder joint ..."

Hongtao Chen, C. Q. Wang, M. Y. Li (2006)

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DOI: 10.1016/J.MICROREL.2005.12.001

access: closed

type: Journal Article

metadata version: 2023-06-21

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Hongtao Chen, C. Q. Wang, M. Y. Li:
Numerical and experimental analysis of the Sn3.5Ag0.75Cu solder joint reliability under thermal cycling. Microelectron. Reliab. 46(8): 1348-1356 (2006)

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