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"Effect of underfill filler settling on thermo-mechanical fatigue analysis ..."

Cheng-fu Chen (2008)

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DOI: 10.1016/J.MICROREL.2008.03.022

access: closed

type: Journal Article

metadata version: 2020-02-22

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Cheng-fu Chen:
Effect of underfill filler settling on thermo-mechanical fatigue analysis of flip-chip eutectic solders. Microelectron. Reliab. 48(7): 1040-1051 (2008)

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