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"Study on reliability of PQFP assembly with lead free solder joints under ..."

F. X. Che, John H. L. Pang (2015)

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DOI: 10.1016/J.MICROREL.2015.09.010

access: closed

type: Journal Article

metadata version: 2023-09-30

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F. X. Che, John H. L. Pang:
Study on reliability of PQFP assembly with lead free solder joints under random vibration test. Microelectron. Reliab. 55(12): 2769-2776 (2015)

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