"High-temperature reliability of Flip Chip assemblies."

Tanja Braun et al. (2006)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2005.06.004

access: closed

type: Journal Article

metadata version: 2021-09-02

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/BraunBKBAR06
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/BraunBKBAR06
Tanja Braun, Karl-Friedrich Becker, Mathias Koch, Volker Bader, Rolf Aschenbrenner, Herbert Reichl:
High-temperature reliability of Flip Chip assemblies. Microelectron. Reliab. 46(1): 144-154 (2006)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.