"Metal fatigue in copper pillar Flip Chip BGA: A refined acceleration model ..."

R. Alberti et al. (2015)

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DOI: 10.1016/J.MICROREL.2015.06.150

access: closed

type: Journal Article

metadata version: 2020-02-22

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R. Alberti, Riccardo Enrici Vaion, A. Mervic, S. Testa:
Metal fatigue in copper pillar Flip Chip BGA: A refined acceleration model for the aluminium pad cracking failure mechanism. Microelectron. Reliab. 55(9-10): 1838-1842 (2015)

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