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"Thermal modeling of wire-bonded power modules considering non-uniform ..."

Mohsen Akbari et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.07.150

access: closed

type: Journal Article

metadata version: 2022-01-03

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Mohsen Akbari, Amir Sajjad Bahman, Paula Diaz Reigosa, Francesco Iannuzzo, Mohammad Tavakoli Bina:
Thermal modeling of wire-bonded power modules considering non-uniform temperature and electric current interactions. Microelectron. Reliab. 88-90: 1135-1140 (2018)

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