"Recent advances in modeling the underfill process in flip-chip packaging."

J. W. Wan, Wen-Jun Zhang, D. J. Bergstrom (2007)

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DOI: 10.1016/J.MEJO.2006.09.017

access: closed

type: Journal Article

metadata version: 2024-08-22

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J. W. Wan, Wen-Jun Zhang, D. J. Bergstrom:
Recent advances in modeling the underfill process in flip-chip packaging. Microelectron. J. 38(1): 67-75 (2007)

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