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"A new die-level flexible design-for-test architecture for 3D stacked ICs."

Qingping Zhang, Wenfa Zhan, Xiaoqing Wen (2024)

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DOI: 10.1016/J.VLSI.2024.102190

access: closed

type: Journal Article

metadata version: 2024-07-11

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Qingping Zhang, Wenfa Zhan, Xiaoqing Wen:
A new die-level flexible design-for-test architecture for 3D stacked ICs. Integr. 97: 102190 (2024)

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