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"Flip-Chip Packaged Micro-Plate For Low Cost Thermal Multiplexing."

Yubo Miao et al. (2003)

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DOI: 10.1142/S1465876303000971

access: closed

type: Journal Article

metadata version: 2020-07-09

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  dblp key:
  - journals/ijces/MiaoCCCZYHL03
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  persistent URL:
  - https://dblp.org/rec/journals/ijces/MiaoCCCZYHL03
Yubo Miao, Chong Ser Chong, Taichong Chai, Yu Chen, Quanbo Zou, Tie Yan, Chew-Kiat Heng, Tit Meng Lim:
Flip-Chip Packaged Micro-Plate For Low Cost Thermal Multiplexing. Int. J. Comput. Eng. Sci. 4(2): 235-238 (2003)

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