International Journal of Computational Engineering Science, Volume 4

Volume 4, Number 1, March 2003

• 
  Wen-Hwa Chen, Chyuan-Jau Shieh:
  On Angular Speed Loss Analysis Of Flat Belt Transmission System By Finite Element Method. 1-18
• 
  P. Frank Pai, Leyland G. Young:
  Fully Nonlinear Modeling And Analysis Of Precision Membranes. 19-65
• 
  G. Andal Jayalakshmi, H. Prabhu, R. Rajaram:
  An Adaptive Mobile Robot Path Planner For Dynamic Environments With Arbitrary-Shaped Obstacles. 67-84
• 
  Shuichi Torii:
  Effect Of Aspect Ratio Of Unsteady Thermal-Fluid Transport Phenomena In Cavities Under Reduced Gravity. 85-97
• 
  Abdeljalil Benyoub, El Mostafa Daoudi:
  Study Of The Parallel Continuous Global Optimization Based On Interval Arithmetic. 99-108
• 
  Lalitha Chattopadhyay:
  Analytical Determination Of Stress Intensity Factor For Plate Bending Problems. 109-119
• 
  Larry A. Lambe, Richard Luczak, John W. Nehrbass:
  A New Finite Difference Method For The Helmholtz Equation Using Symbolic Computation. 121-144

Volume 4, Number 2, June 2003

Special Issue on Microelectromechanical Systems (ICMAT 2003: Symposium G), Part 1

• 
  Robin H. Liu, Jianing Yang, Ralf Lenigk, Justin Bonanno, Frederic Zenhausern, Piotr Grodzinski:
  Fully Integrated Microfluidic Biochips For Dna Analysis. 145-150
• 
  Thomas Gessner, Andreas Bertz, Christian Lohmann, Steffen Kurth, Karla Hiller:
  Advanced Silicon Micromachining. 151
• 
  J. G. E. Gardeniers, A. Van Den Berg:
  Lab-On-A-Chip Systems For Biomedical And Environmental Monitoring. 157-162
• 
  Paul Muralt:
  Piezoelectric Micromachined Ultrasonic Transducers For Rf Filtering And Ultrasonic Imaging. 163-168
• 
  Taher Saif, Aman Haque:
  Mechanical Behavior Of Nano Scale Thin Films Using Mems Sensors. 169-173
• 
  Volker Saile:
  Fabrication Of Polymer Microsystems. 175-180
• 
  Dong-Il Cho, Byoung-Doo Choi, Sangwoo Lee, Seung Joon Paik, Sangjun Park, Jaehong Park, Yonghwa Park, Jongpal Kim, Il-Woo Jung:
  Dry And Wet Etching With (111) Silicon For High-Performance Micro And Nano Systems. 181-187
• 
  Arun Majumdar:
  Mems As A Platform For Nanoexploration And Nanointegration. 189-194
• 
  Minhang Bao, Yuancheng Sun, Yiping Huang, Yuelin Wang:
  Safe Operation Conditions Of Capacitive Inertial Sensor For Dynamic Signals. 195-200

Actuators and Sensors

• 
  W. T. Lin, J. C. Chiou:
  Multi-Directional Dual Comb-Drive Actuator For Optical Applications. 201-204
• 
  Yuan Xu, Christina Yuan Ling Tan, Wen Ping Wang, Francis Eng Hock Tay:
  Simulation Of Large Membrane Deformation In An Electrochemical Actuator. 205-210
• 
  Y. Lu, J. P. Yang, N. B. Chong:
  A Novel Design Of R/W Head Positioning Microactuator In Hard Disc Drives. 211-214
• 
  Ajay Agarwal, Terence Gan, Janak Singh, Yue K. Hoh, Andrew A. O. Tay:
  Study On Bimorph And Multimorph Microactuators. 215-219
• 
  Yongqing Fu, Hejun Du, Weimin Huang, Min Hu:
  Tini Film Based Shape Memory Alloy And Microactuators. 221-225
• 
  Bangtao Chen, Jianmin Miao, Hong Zhu:
  Analysis And Comparison Of Flexure Structures Used In 3-D Electrostatic Microactuators For Hard Disk Drives. 227-230

BioMEMS and Microfluids

• 
  Yubo Miao, Yu Chen, Quanbo Zou, Janak Singh, Tie Yan, Chew-Kiat Heng, Tit Meng Lim:
  Low Cost Micro-Pcr Array And Micro-Fluidic Integration On Single Silicon Chip. 231-234
• 
  Yubo Miao, Chong Ser Chong, Taichong Chai, Yu Chen, Quanbo Zou, Tie Yan, Chew-Kiat Heng, Tit Meng Lim:
  Flip-Chip Packaged Micro-Plate For Low Cost Thermal Multiplexing. 235-238
• 
  Yiping Huang, Jilie Kong, Jia Zhou, Yingcai Long, Po Li, Haifen Xie, Minhang Bao:
  Zeolite And Polymer Film Bio-Chemical Mems Sensors. 239-242
• 
  K. T. Ooi, C. Yang, C. K. Chai, T. N. Wong, P. H. Ang:
  Effects Of Electric Double Layer And Viscous Dissipation In Microcapillary. 243-248
• 
  Thai-Quang Truong, Xiao-Yang Huang, Nam-Trung Nguyen:
  Polymeric Stack-Assembled Micropump With SU-8 Check Valves. 249-252
• 
  Guolin Xu, Dor Ngi Ting, Vincent Luar, Lin Kiat Saw:
  A Disposable Self-Priming And Bubble Tolerance Pneumatic Actuation Micro-Pump. 253-256
• 
  Michael J. Schöning, Arshak Poghossian, Joachim W. Schultze:
  Measuring Seven Parameters By Two Isfet-Modules In A Microcell Set-Up. 257-260
• 
  Yuejun Kang, Chun Yang, Xiaoyang Huang:
  Modelling Of The Capillary Electrochromatography With Application In Biomems. 261-264
• 
  E. Y. K. Ng, N. Y. Liu, C. H. Ang:
  A Multi-Coefficient Slip Model For Ultra-Thin Gas Film Lubrication. 265-268
• 
  Zhigang Wu, Thai-Quang Truong, Nam-Trung Nguyen, Xiao-Yang Huang:
  Characterization Of Microfluidic Devices Using Micro Particle Image Velocimetry. 269-272
• 
  C. Yang, T. N. Wong, Y. L. Leu, K. T. Ooi, J. C. Chai:
  Characterization Of Electroosmotic Flow In Microchannels. 273-276
• 
  Guolin Xu, Francis Eng Hock Tay, Yuanzhi Lao, Ciprian Iliescu, Yuan Hong Yu, Vincent Luar, Diana Hartono, Y. Y. Lee:
  A Dielectrophoresis-Based Bio-Sample Preparation. 277-280
• 
  Han Zhang, Franck Chollet, Etienne Burdet, Aun Neow Poo, Dietmar Werner Hutmacher:
  Fabrication Of 3-D Microparts For The Assembly Of Scaffold/Cell Constructs In Tissue Engineering. 281-284
• 
  Qinghui Wang, Yin Tan, Haiqing Gong:
  An Integrated System For Real-Time Pcr Analysis Based On Microfluidic Biochip. 285-288
• 
  Kwong-Luck Tan, Francis Eng Hock Tay:
  Memswear - Incorporating Mems Technology Into Smart Shirt For Geriatric Healthcare. 289-292
• 
  Yeow-Sheong Wong, Francis Eng Hock Tay, Kwong-Luck Tan:
  Memswear Fall Sensing System For The Elderly: Design Of A Threshold Accelerometer For Impact Sensing. 293-296

Silicon Micromachining

• 
  Ranganathan Nagarajan, Ajay Agarwal:
  Laterally Isolated Polysilicon Beam Process. 297-301
• 
  Q. X. Zhang, Q. Y. Guo, J. Li, A. Q. Liu:
  Investigation Of Loading Effect In Deep Trench Lisa Technology. 303-306
• 
  Xiao Lin Zhang, Janak Singh, Ajay Agarwal, Q. X. Zhang:
  A New Process For Fabricating Convex Corners In Silicon. 307-310
• 
  Ajay Agarwal, Xiao Lin Zhang, Terence Gan, Janak Singh:
  Thin Silicon Structures Fabrication By Wet Anisotropic Etching. 311-314
• 
  M. Tang, Ajay Agarwal, Q. X. Zhang, A. Q. Liu:
  An Approach Of Shadow Mask For Deep-Holes Patterning. 315-318
• 
  Tietun Sun, Jianmin Miao, Hong Zhu, Ciprian Iliescu, Jianbo Sun:
  Study On Feature Of Silicon Microtrenches With A Multiplexed Inductively Coupled Plasma Etcher. 319-322
• 
  Wenjiang Zeng, Huamao Lin, Xiaolin Zhang, Ramasamy Chockalingam, Wee Chong Heng, Sangki Hong, Narayanan Balasubramanian:
  Effects Of Wafer Bonding And Thinning Processes On Electrical Performance Of Mos Devices. 323-326
• 
  Jaehong Park, Kidong Park, Seung Joon Paik, Kyo-In Koo, Byoung-Doo Choi, Jongpal Kim, Sangjun Park, Il-Woo Jung, Hyoungho Ko, Dong-Il Cho:
  Extremely Sharp {111}-Bound, Single-Crystalline Silicon Nano Tips. 327-330

Packaging

• 
  Jun Wei, F. L. Ng, M. L. Nai, H. Xie, Peck Cheng Lim, C. K. Wong:
  Wafer Bonding Process Based On The Taguchi Analysis. 331-334
• 
  Yufeng Jin, Jun Wei, Peck Cheng Lim, Zhenfeng Wang:
  Hermetic Packaging Of Mems With Thick Electrodes By Silicon-Glass Anodic Bonding. 335-338
• 
  Zhenfeng Wang, G. J. Qi, Jun Wei, Peck Cheng Lim, Yufeng Jin, C. K. Wong:
  A Novel Wafer-Level Packaging Solution For Mems. 339-342
• 
  Ciprian Iliescu, Jianmin Miao, Marioara Avram:
  Fabrication Of Chip Scale Piezoresistive Pressure Sensors Using Screen-Printed Glass Frit Packaging. 343-346
• 
  Tong Yan Tee, Giovanni Frezza, Mayhuan Lim, Hun Shen Ng, Federico Ziglioli, Zhaowei Zhong:
  Design For Board Level Reliability Of A Miniaturized Mems Package: Stacked Die Tqfn. 347-350
• 
  W. B. Yu, Jun Wei, Cher Ming Tan, S. S. Deng, M. L. Nai:
  Influence Of Applied Load On Wafer Bonding In Vacuum. 351-354
• 
  C. T. Wee, Y. Lu, J. P. Yang:
  Investigation Of Si-Altic Wafer Bonding Using SU-8. 355-358
• 
  Andreas H. Foitzik, Mechtilde Schäfer, Wolfgang Kaese:
  High Resolution Microchemical Analysis Of Interfaces In Wire Bonds. 359-362

Wireless MEMS/RF MEMS

• 
  Jianbo Sun, Jianmin Miao, Tietun Sun, Hong Zhu:
  Development And Comparison Of Micromachined Inductors For Rf Applications. 363-367
• 
  M. Tang, Ajay Agarwal, P. Win, Q. X. Zhang, J. Li, A. Q. Liu:
  A New Lateral Rf Switch Using Soi-Deep-Etching Fabrication Process. 369-372
• 
  Xue-Jie Zhang, Z. X. Shen, A. Q. Liu:
  Mems-Switch-Based Reconfigurable Antenna. 373-376
• 
  A. B. Yu, Q. X. Zhang, A. Q. Liu:
  Design Of A Novel Microwave Mems Tunable Filter. 377-380
• 
  P. Win, A. Q. Liu:
  A Novel Soi Micromachined Relay For True-Time-Delay Systems Applications. 381-384

Design, Modelling and Simulation

• 
  Fouad Bennini, Jan Mehner, Wolfram Dötzel:
  System Level Simulations Of Mems Based On Reduced Order Finite Element Models. 385-388
• 
  S. T. Tan, E. Y. K. Ng:
  Numerical Studies Of Developing Flow In Microchannel. 389-392
• 
  M. Shamshirsaz, M. Bahrami, M. Tayefeh:
  Finite Element Analysis Of Time-Dependent Buckling Of Polysilicon Micro Beams With Temperature-Dependent Properties. 393-396
• 
  Nisarga N. Naik, Ashish A. Ghangrekar, Sameer U. Kalghatgi, Smitha S. Shetty, Prakash R. Apte:
  Electrical And Heat Flow Simulation Of Mems Structures Using Spice. 397-400
• 
  Andojo Ongkodjojo, Francis Eng Hock Tay:
  Slide Film Damping And Squeeze Film Damping Models Considering Gas Rarefaction Effects For Mems Devices. 401-404
• 
  M. B. Liu, G. R. Liu, K. Y. Lam:
  Computer Simulation Of Flip-Chip Underfill Encapsulation Process Using Meshfree Particle Method. 405-408
• 
  W. J. Wang, R. M. Lin, T. T. Sun, D. G. Guo:
  A Novel Mems Fabry-Perot Microcavity Structure For Pressure Sensing Application. 409-412
• 
  Xiaochong Deng, Jiaping Yang, Tow Chong Chong:
  Design And Modeling Of Thermally Actuated Micromirror For Fine-Tracking Mechanism Of High-Density Optical Data Storage. 413-416
• 
  J. C. Chiou, Y. J. Lin:
  A Novel Application Of Contact Friction For Laterally Motion Tunable Acceleration-Threshold Switch: Modeling And Simulation. 417-420
• 
  X. Y. Chen, C. Yang, K. C. Toh, J. C. Chai:
  Numerical Analysis Of The Edl Effect On Liquid Flow In Microchannels. 421-424
• 
  W. Z. Li, B. C. Khoo, D. Xu:
  Near-Wall Hot-Wire Correction Based On Y⁺ AND H₀. 425-430
• 
  W. Z. Li, J. M. Xue, Z. H. Zhou, J. Wang, Hong Zhu, Jianmin Miao, S. J. O'Shea:
  Design Issues Of Multilayer Piezoelectric Biosensors. 431-434

Volume 4, Number 3, September 2003

Optical MEMS

• 
  Y. C. Lin, J. C. Chiou, C. L. Chen:
  A Digital/Analog Electrostatic Actuating Mechanism For Optical Applications. 435-438
• 
  H. Cai, C. W. Chan, Keck Voon Ling, C. Lu, Y. X. Wang, A. Q. Liu:
  A Study Of Closed-Loop Control Of Optical MEMS Device. 439-442
• 
  Franck Chollet, Chun Hong Low, Sok Kim Lee, Chun Yang:
  Fabrication Of Concave And Convex Micro-Optical Elements With Polymer For Free-Space Micro-Optical Bench. 443-446
• 
  H. B. Liu, Franck Chollet:
  Optical Switch Based On Moving Polymer Waveguides And Self-Latching Structure. 447-450
• 
  J. Li, J. B. Zhang, X. M. Zhang, C. Lu, Q. X. Zhang:
  Instructions Micromachined Tunable Filter Via Actuation Of Fabry-Parot Cavity. 451-454
• 
  A. Q. Liu, X. M. Zhang, J. Li, D. Y. Tang:
  Characteristics Of Micromachined Short-External-Cavity Tunable Lasers. 455-459
• 
  S. H. Wang, C. Quan, C. J. Tay, I. Reading, Z. P. Fang:
  Characterization Of The Deformation Of Micro-Components Using Optical Interferometry. 461-465

Testing and Characterisation

• 
  Andreas H. Foitzik, Wolfgang Kaese, Thomas Vogt, Michael Sommerer, Serguei Arkhipov:
  Static And Dynamic Characterization Of Mems Via ESPI. 467-470
• 
  Jacek Baborowski, Nicolas Ledermann, Paul Muralt, Daniel Schmitt:
  Simulation And Characterization Of Piezoelectric Micromachined Ultrasonic Transducers (pMUTs) Based On Pzt/Soi Membranes. 471-475
• 
  Ashok Kumar Pandey, R. Pratap:
  Studies In Nonlinear Effects Of Squeeze Film Damping In Mems Structures. 477-480
• 
  W. M. Yang, S. K. Chou, Chang Shu, Z. W. Li, H. Xue:
  Power Generation At The Micro Scale. 481-484
• 
  K. N. Bhat, B. R. K. Reddy, V. Vinoth Kumar, K. Siva Kumar, Y. Sushma, N. Ramesh Babu, K. Natarajan:
  Design Optimization, Fabrication And Testing Of A Capacitive Silicon Accelerometer Using An Soi Approach. 485-488
• 
  Prem Pal, Suneet Tuli, Sudhir Chandra:
  Design And Fabrication Of SIO₂ Micromechanical Structures Inside Anisotropically Etched Cavity. 489-492

Fabrication Process/Fabrication Technique

• 
  Dongil Cho, Hyoungho Ko, Jongpal Kim, Sangjun Park, Donghun Kwak, Taeyong Song, William Carr, James Bus:
  A Novel Z-Axis Accelerometer With Perfectly-Aligned, Fully-Offset Vertical Combs Fabricated Using The Extended Sacrificial Bulk Micromachining Process. 493-496
• 
  Andrew B. Randles, Brett J. Pokines, Shuji Tanaka, Masayoshi Esashi:
  Deep Structures Wet Etched Into Lithium Niobate Using A Physical Mask. 497-500
• 
  Jianxia Gao, Mary B. Chan-Park, Dongzhu Xie, Bryan K. A. Ngoi, Chee Yoon Yue:
  Sub-Micron Patterning Titanium Nitride By Focused Ion-Beam Technique. 501-504
• 
  V. Pradeep Kumar, Shreepad Karmalkar:
  Study Of Electroless Nickel On Polished Silicon For Mems Applications. 505-508
• 
  Hong Zhu, Jianmin Miao, Bangtao Chen, Zhihong Wang, Weiguan Zhu:
  Micromachining Process Of Piezoelectric Microcantilever Using Pzt Thin Film. 509-512
• 
  X. B. Zeng, J. F. Li, X. W. Sun, G. J. Qi, X. T. Zeng:
  Polycrystalline Silicon Thin Film Obtained By Aluminum Induced Crystallization. 513-516
• 
  K. L. Zhang, S. K. Chou, Simon S. Ang, X. S. Tang, J. S. Phang:
  Investigation Of Solid Propellant Microthrusters. 517-520

Materials

• 
  Sudhir Chandra, Vivekanand Bhatt, Shrawan K. Jha:
  Sputtered Silicon Dioxide Films For Mems Application. 521-524
• 
  Gregor Wiche, Jost Goettert, Yujun Song, Josef Hormes, Challa S. S. R. Kumar:
  Functional Micro Devices Using 'Nanoparticle-Photoresist' Composites. 525-528
• 
  Zhong-Geng Ling, Kun Lian, Jian Zhang:
  Characterization And Application Of Pag Diluted SU-8. 529-532
• 
  Kun Lian, J. C. Jiang, S. Wen, C. G. Liu, Zhong-Geng Ling:
  Thermal Stability And Resulting Surface Mechanical Properties Of Electroplated Nanocrystalline Ni-Based Mems Material. 533-536
• 
  Shuhui Yu, Kui Yao, Francis Eng Hock Tay:
  (100)-Oriented PZN-xpt Thin Films Grown On Lanio₃ Seeding Layers. 537-541
• 
  Tibor Lalinsky, M. Krnac, S. Hascik, Z. Mozolova, L. Matay, I. Kostic, P. Hrkut, Jiri Jakovenko, Miroslav Husák:
  Micromechanical Thermal Converter Device Based On Polyimide-Fixed Island Structure. 543-546
• 
  Ning Jiang, Rajnish K. Sharma, Hanhua Feng, Zhe Wang, Xiaowei Wang:
  Impact Of Deposition Parameters On The Characterizations Of Highly Orientated Aluminum Nitride For Film Bulk Acoustic Resonator Device. 547-550
• 
  Jian-Jun Yuan, Shi-Yuan Cheng, Lei Jiang, Lin-Xian Feng, Zhi-Qiang Fan:
  Nanostructured Aggregates From The Self-Assembly Of Bab Triblock Copolymers With A Hydrophilic Middle Block A In Water. 551-554
• 
  C. Venkatesh, Shashidhar Pati, Navakanta Bhat:
  Torsional Mems Varactor With Low Actuation Voltage. 555-558

Poster Papers

• 
  Ching Lian Chua, Franck Chollet, Jie He:
  Study Of A Biological Actuator And Sensor: The Mimosa Pudica. 559-562
• 
  F. Calame, Jacek Baborowski, Nicolas Ledermann, Paul Muralt:
  Local Growth Of SOL-GEL Films By Means Of Microhotplates. 563-568
• 
  J.-M. Huang, A. Q. Liu, X. M. Zhang, J. Ahn:
  A Novel Lumped Two Degrees Of Freedom Pull-In Approach To Electrostatic Torsional Micromirrors. 569-572
• 
  J.-M. Huang, A. Q. Liu:
  Tunable Microelectromechanical Capacitor With Wide Tuning Ranges. 573-576
• 
  J. Li, Q. X. Zhang, A. Q. Liu:
  Prevent Notching For Soi Microstructure Fabrication Using SIO₂ Thin Film Technique. 577-580
• 
  Liujiang Yu, B. K. Tay, D. Sheeja, Y. Q. Fu, Jianmin Miao:
  Fabrication Of Amorphous Carbon Micro-Membranes By Deep Reactive Ion Etching Technique. 581-584
• 
  Jong Ren Kong, Oliver Wilhelmi, Herbert O. Moser:
  Gap Optimisation For Proximity X-Ray Lithography Using The Super-Resolution Process. 585-588
• 
  Il-Woo Jung, Jaehong Park, Byoung-Doo Choi, Jongpal Kim, Sangjun Park, Seung Joon Paik, Dong-Il Cho:
  New Vertical Array Actuators Using Extended Sbm And Deep Pn Junction Isolation. 589-592
• 
  Guangya Zhou, Francis Eng Hock Tay, Chau Fook Siong:
  Modeling Of A Two-Axis Torsional Micromirror Using Ahdl. 593-596
• 
  Mechtilde Schäfer, Matthias Walz, Reiner Stein, Lars Vollmer, Günther Schuster, Andreas H. Foitzik:
  The Goeppingen Genereactor For Dna-Analysis. 597-600
• 
  Mechtilde Schäfer, R. Starzmann, Andreas H. Foitzik:
  Chemical Microreactors For In-Situ Online Process Monitoring. 601-604
• 
  Andreas H. Foitzik, Mechtilde Schäfer, Reiner Stein, Lars Vollmer, Günther Schuster:
  Three Dimensional Reference Structures For Confocal Microscopy. 605-608
• 
  Matthias Küchler, Thomas Otto, Thomas Gessner, Frank Ebling, Henning Schröder:
  Hot Embossing For Mems Using Silicon Tools. 609-612
• 
  Woei Wan Tan, Pei Ge, Francis Eng Hock Tay, Ai Poh Loh:
  Development Of A 3-Plates Capacitive Pressure Sensor. 613-616
• 
  Y. Murakoshi, Xuechuan Shan, Ryutaro Maeda:
  Application Of Micro Hot Embossing For MEMS Structures. 617-620
• 
  H. Liu, Stephen Yee Ming Wan, G. C. Lim, Andrew A. O. Tay:
  The Development Of A Polymer Based Piezo-Actuated Micropump. 621-625
• 
  Rakesh P. Dhote, Sudhir S. Chiluveru, Saurabh A. Chandorkar, Prakash R. Apte:
  A Novel Heatuator. 627-630
•