"Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated ..."

Perceval Coudrain et al. (2016)

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DOI: 10.1109/MDAT.2015.2506678

access: closed

type: Journal Article

metadata version: 2024-05-07

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Perceval Coudrain, Papa Momar Souare, Rafael Prieto, Vincent Fiori, Alexis Farcy, Laurent Le Pailleur, Jean-Philippe Colonna, Cristiano Santos, Pascal Vivet, M. Haykel Ben Jamaa, Denis Dutoit, François de Crecy, Sylvain Dumas, Christian Chancel, Didier Lattard, Séverine Cheramy:
Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits. IEEE Des. Test 33(3): 21-36 (2016)

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