"MORE-Stress: Model Order Reduction based Efficient Numerical Algorithm for ..."

Tianxiang Zhu et al. (2024)

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DOI: 10.48550/ARXIV.2411.12690

access: open

type: Informal or Other Publication

metadata version: 2025-01-01

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  - https://dblp.org/rec/journals/corr/abs-2411-12690
Tianxiang Zhu, Qipan Wang, Yibo Lin, Runsheng Wang, Ru Huang:
MORE-Stress: Model Order Reduction based Efficient Numerical Algorithm for Thermal Stress Simulation of TSV Arrays in 2.5D/3D IC. CoRR abs/2411.12690 (2024)

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