"Effects of thermal aging on Cu nanoparticle/Bi-Sn solder hybrid bonding."

Masanori Usui et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.07.096

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type: Journal Article

metadata version: 2023-09-30

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Masanori Usui, Toshikazu Satoh, Hidehiko Kimura, S. Tajima, Y. Hayashi, Daigo Setoyama, Masashi Kato:
Effects of thermal aging on Cu nanoparticle/Bi-Sn solder hybrid bonding. Microelectron. Reliab. 78: 93-99 (2017)

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