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"Study of metal adhesion on porous low-k dielectric using telephone cord ..."

Ming He et al. (2011)

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DOI: 10.1016/J.MICROREL.2010.11.015

access: closed

type: Journal Article

metadata version: 2020-10-02

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Ming He, C. Gaire, G.-C. Wang, Toh-Ming Lu:
Study of metal adhesion on porous low-k dielectric using telephone cord buckling. Microelectron. Reliab. 51(4): 847-850 (2011)

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