"Leakage-Aware TSV-Planning with Power-Temperature-Delay Dependence in 3D ICs."

Kan Wang et al. (2011)

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DOI: 10.1587/TRANSFUN.E94.A.2490

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type: Journal Article

metadata version: 2020-04-11

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Kan Wang, Sheqin Dong, Yuchun Ma, Yu Wang, Xianlong Hong, Jason Cong:
Leakage-Aware TSV-Planning with Power-Temperature-Delay Dependence in 3D ICs. IEICE Trans. Fundam. Electron. Commun. Comput. Sci. 94-A(12): 2490-2498 (2011)

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