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"TSV density-driven global placement for 3D stacked ICs."

Dae Hyun Kim, Rasit Onur Topaloglu, Sung Kyu Lim (2011)

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DOI: 10.1109/ISOCC.2011.6138665

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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  - conf/isocc/KimTL11
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Dae Hyun Kim, Rasit Onur Topaloglu, Sung Kyu Lim:
TSV density-driven global placement for 3D stacked ICs. ISOCC 2011: 135-138

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