"Enhancement of simulation-based semiconductor manufacturing forecast ..."

Patrick Preuss et al. (2014)

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DOI: 10.1109/WSC.2014.7020088

access: closed

type: Conference or Workshop Paper

metadata version: 2021-06-10

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  - https://dblp.org/rec/conf/wsc/PreussNSGL14
Patrick Preuss, André Naumann, Wolfgang Scholl, Boon-Ping Gan, Peter Lendermann:
Enhancement of simulation-based semiconductor manufacturing forecast quality through hybrid tool down time modeling. WSC 2014: 2444-2453

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