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"A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using ..."
Suresh Venkatesan et al. (2022)
- Suresh Venkatesan, James Lee, Simon Chun Kiat Goh, Brian Pile, Daniel Meerovich, Jinyu Mo, Yang Jing, Lucas Soldano, Baochang Xu, Yu Zhang, Aaron Voon-Yew Thean, Yeow Kheng Lim:
A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical InterposerTM. VLSI Technology and Circuits 2022: 381-382
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