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"Advanced BEOL Materials, Processes, and Integration to Reduce Line ..."

Takeshi Nogami et al. (2022)

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DOI: 10.1109/VLSITECHNOLOGYANDCIR46769.2022.9830488

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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  - conf/vlsit/NogamiGSNPHSLPS22
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  - https://dblp.org/rec/conf/vlsit/NogamiGSNPHSLPS22
Takeshi Nogami, Oleg Gluschenkov, Yasir Sulehria, Son Nguyen, Brown Peethala, Huai Huang, Hosadurga Shobha, Nick Lanzillo, Raghuveer Patlolla, Devika Sil, Andrew Simon, Daniel Edelstein, Nelson Felix, Junjun Liu, Toshiyuki Tabata, Fulvio Mazzamuto, Sebastien Halty, Fabien Rozé, Yasutoshi Okuno, Akira Uedono:
Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects. VLSI Technology and Circuits 2022: 423-424

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