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"Post-bond Repair of Line Faults with Double-bit ECC for 3D Memory."

Younwoo Yoo et al. (2021)

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DOI: 10.1109/ISOCC53507.2021.9613892

access: closed

type: Conference or Workshop Paper

metadata version: 2024-02-27

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  dblp key:
  - conf/isocc/YooLSK21
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  - https://dblp.org/rec/conf/isocc/YooLSK21
Younwoo Yoo, Hayoung Lee, Seung Ho Shin, Sungho Kang:
Post-bond Repair of Line Faults with Double-bit ECC for 3D Memory. ISOCC 2021: 427-428

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