"CPI reliability and EMI benefit for MIM CAP embedded C4 package."

Hyunsuk Chun et al. (2015)

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DOI: 10.1109/IRPS.2015.7112753

access: closed

type: Conference or Workshop Paper

metadata version: 2024-03-04

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Hyunsuk Chun, In Hak Baick, Sangsu Ha, Eunmi Kwon, Seungbae Lee, Seil Kim, Sangwoo Pae, Jongwoo Park:
CPI reliability and EMI benefit for MIM CAP embedded C4 package. IRPS 2015: 5

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