"Designing 3D test wrappers for pre-bond and post-bond test of 3D embedded ..."

Dean L. Lewis et al. (2011)

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DOI: 10.1109/ICCD.2011.6081381

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-23

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Dean L. Lewis, Shreepad Panth, Xin Zhao, Sung Kyu Lim, Hsien-Hsin S. Lee:
Designing 3D test wrappers for pre-bond and post-bond test of 3D embedded cores. ICCD 2011: 90-95

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