"Temperature-Aware Sizing of Multi-Chip Module Accelerators for Multi-DNN ..."

Prachi Shukla et al. (2023)

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DOI: 10.23919/DATE56975.2023.10137047

access: closed

type: Conference or Workshop Paper

metadata version: 2023-06-07

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Prachi Shukla, Derrick Aguren, Tom Burd, Ayse K. Coskun, John Kalamatianos:
Temperature-Aware Sizing of Multi-Chip Module Accelerators for Multi-DNN Workloads. DATE 2023: 1-6

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