"Flexible Thermal Conductance Model (TCM) for Efficient Thermal Simulation ..."

Shunxiang Lan, Min Tang, Jun Ma (2025)

> Home

Details and statistics

DOI: 10.23919/DATE64628.2025.10993265

access: closed

type: Conference or Workshop Paper

metadata version: 2025-05-31

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/date/LanTM25
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/date/LanTM25
Shunxiang Lan, Min Tang, Jun Ma:
Flexible Thermal Conductance Model (TCM) for Efficient Thermal Simulation of 3-D ICs and Packages. DATE 2025: 1-6

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.